쌀알만한 '이것' 없어서 데이터센터 중지.. 차세대 메모리라고?
월텍남 - 월스트리트 테크남 · 7:16 · Watch on YouTube
The video argues that the AI hardware bottleneck has moved from GPUs to small components. Advanced substrates (ABF/FCBGA), MLCCs and CPU-side memory modules (SOCAMM) now have lead times of 35–56 weeks. New capacity wo...